Invention Grant
- Patent Title: Decoupling capacitor for integrated circuit
- Patent Title (中): 集成电路去耦电容
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Application No.: US13784811Application Date: 2013-03-04
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Publication No.: US09053960B2Publication Date: 2015-06-09
- Inventor: Pratyush Kamal , Mukul Gupta , Foua Vang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L27/08 ; H01L29/66 ; H01L27/01 ; H01L29/94
Abstract:
An integrated circuit includes a capacitor having first, second and third nodes. The first and second nodes of the first transistor are connected together and the first and second nodes of the second transistor are connected together. The third node of the first transistor is connected to the third node of the second transistor. Each of the third nodes is constructed so that each node comprises a width and a length that is at least ten percent of the width.
Public/Granted literature
- US20140246715A1 DECOUPLING CAPACITOR FOR INTEGRATED CIRCUIT Public/Granted day:2014-09-04
Information query
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