Invention Grant
- Patent Title: Semiconductor device and fabrication process thereof
- Patent Title (中): 半导体器件及其制造工艺
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Application No.: US13862894Application Date: 2013-04-15
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Publication No.: US09053962B2Publication Date: 2015-06-09
- Inventor: Yoshikazu Tsukidate
- Applicant: FUJITSU SEMICONDUCTOR LIMITED
- Applicant Address: JP Yokohama
- Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee: FUJITSU SEMICONDUCTOR LIMITED
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-149745 20120703
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L29/786 ; H01L27/02 ; H01L27/092 ; H01L29/78 ; H01L21/8238

Abstract:
A disclosed semiconductor device includes a semiconductor substrate including a first area, a gate electrode formed over the first area of the semiconductor substrate, a first active region formed in the first area of the semiconductor substrate at a lateral side of the gate electrode, a first silicide layer formed at least on a sidewall surface of the gate electrode in the first area, the first silicide layer is electrically connected to the first active region.
Public/Granted literature
- US20140008735A1 SEMICONDUCTOR DEVICE AND FABRICATION PROCESS THEREOF Public/Granted day:2014-01-09
Information query
IPC分类: