Invention Grant
- Patent Title: Pillar bump formed using spot-laser
- Patent Title (中): 使用点激光形成的柱凸起
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Application No.: US14086932Application Date: 2013-11-21
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Publication No.: US09053972B1Publication Date: 2015-06-09
- Inventor: Chee Seng Foong , Lan Chu Tan
- Applicant: Chee Seng Foong , Lan Chu Tan
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L23/00
Abstract:
A pillar bump, such as a copper pillar bump, is formed on an integrated circuit chip by applying a metallic powder over a conductive pad on a surface of the chip. The metallic powder is selectively spot-lasered to form the pillar bump. Any remaining unsolidified metallic powder may be removed from the surface of the chip. This process may be repeated to increase the bump height. Further, a solder cap may be formed on an outer surface of the pillar bump.
Public/Granted literature
- US20150137354A1 PILLAR BUMP FORMED USING SPOT-LASER Public/Granted day:2015-05-21
Information query
IPC分类:
