Invention Grant
US09053997B2 Solid-state image sensor, method of manufacturing the same, and camera with dummy patterns
有权
固态图像传感器，其制造方法和具有虚拟图案的相机
- Patent Title: Solid-state image sensor, method of manufacturing the same, and camera with dummy patterns
- Patent Title (中): 固态图像传感器，其制造方法和具有虚拟图案的相机
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Application No.: US13718416Application Date: 2012-12-18
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Publication No.: US09053997B2Publication Date: 2015-06-09
- Inventor: Satoshi Hirayama , Mariko Furuta
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-008449 20120118
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H01L27/146 ; H04N5/369
Abstract:
A solid-state image sensor having a pixel region and a peripheral circuit region, includes wiring lines arranged in the pixel region and the peripheral circuit region, dummy patterns arranged in the peripheral circuit region, and a planarizing layer arranged on the wiring lines and containing a resin. The wiring lines in the peripheral circuit region include a plurality of electrically conductive patterns. The dummy patterns are arranged between the plurality of electrically conductive patterns. The dummy patterns are electrically insulated from the wiring lines.
Public/Granted literature
- US20130182162A1 SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND CAMERA Public/Granted day:2013-07-18
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