Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13812503Application Date: 2012-10-12
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Publication No.: US09054018B2Publication Date: 2015-06-09
- Inventor: Xiaolong Ma , Huaxiang Yin , Sen Xu , Huilong Zhu
- Applicant: Xiaolong Ma , Huaxiang Yin , Sen Xu , Huilong Zhu
- Applicant Address: CN Beijing
- Assignee: The Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: The Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Treasure IP Group, LLC
- Priority: CN201210293347 20120816
- International Application: PCT/CN2012/001378 WO 20121012
- International Announcement: WO2014/026307 WO 20140220
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/84 ; H01L29/15 ; H01L29/66 ; H01L29/78 ; H01L29/10 ; B82Y10/00 ; H01L29/51 ; H01L29/165

Abstract:
The present invention discloses a method for manufacturing a semiconductor device, which comprises: forming a plurality of fins on a substrate, which extend along a first direction and have rhombus-like cross-sections; forming a gate stack structure on each fin, which traverses the plurality of fins and extends along a second direction; wherein a portion in each fin that is under the gate stack structure forms a channel region of the device, and portions in each fin that are at both sides of the gate stack structure along the first direction form source and drain regions. The semiconductor device and its manufacturing method according to the present invention use rhombus-like fins to improve the gate control capability to effectively suppress the short channel effect, moreover, an epitaxial quantum well is used therein to better limit the carriers, thus improving the device drive capability.
Public/Granted literature
- US20140217362A1 Semiconductor Device and Method for Manufacturing The Same Public/Granted day:2014-08-07
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