Invention Grant
- Patent Title: Transistors and fabrication method
- Patent Title (中): 晶体管及制作方法
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Application No.: US13832933Application Date: 2013-03-15
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Publication No.: US09054021B2Publication Date: 2015-06-09
- Inventor: Deyuan Xiao , Emily Shu
- Applicant: Semiconductor Manufacturing International Corp.
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201210492206 20121127
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/49 ; H01L29/786 ; H01L29/04

Abstract:
A method is provided for fabricating a transistor. The method includes providing a semiconductor substrate, and forming a metal layer on the semiconductor substrate. The method also includes forming a silicon layer having at least one layer of graphene-like silicon on the metal layer, and forming a metal oxide layer by oxidizing a portion of the metal layer underneath the silicon layer. Further, the method includes forming a source region and a drain region connecting with the silicon layer.
Public/Granted literature
- US20140145269A1 TRANSISTORS AND FABRICATION METHOD Public/Granted day:2014-05-29
Information query
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