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US09054021B2 Transistors and fabrication method 有权
晶体管及制作方法

Transistors and fabrication method
Abstract:
A method is provided for fabricating a transistor. The method includes providing a semiconductor substrate, and forming a metal layer on the semiconductor substrate. The method also includes forming a silicon layer having at least one layer of graphene-like silicon on the metal layer, and forming a metal oxide layer by oxidizing a portion of the metal layer underneath the silicon layer. Further, the method includes forming a source region and a drain region connecting with the silicon layer.
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