Invention Grant
- Patent Title: Methods for integration of pore stuffing material
- Patent Title (中): 孔填料的整合方法
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Application No.: US13903802Application Date: 2013-05-28
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Publication No.: US09054052B2Publication Date: 2015-06-09
- Inventor: Nicholas Vincent Licausi , Errol Todd Ryan , Ming He , Moosung M. Chae , Kunaljeet Tanwar , Larry Zhao , Christian Witt , Ailian Zhao , Sean X. Lin , Xunyuan Zhang
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBAL FOUNDRIES INC.
- Current Assignee: GLOBAL FOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti, P.C.
- Main IPC: H01L21/314
- IPC: H01L21/314 ; H01L21/308 ; H01L21/32 ; H01L29/06
Abstract:
A process is provided for methods of reducing damage to an ultra-low k layer during fabrication. In one aspect, a method includes: providing a cured ultra-low k film containing pores filled with a pore-stuffing material; and modifying an exposed surface of the ultra-low k film to provide a modified layer in the ultra-low k film. In another aspect, a semiconductor device comprising a modified layer on a surface of an ultra-low k film is provided.
Public/Granted literature
- US20140353802A1 METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL Public/Granted day:2014-12-04
Information query
IPC分类:
