Invention Grant
- Patent Title: Stacked interconnect heat sink
- Patent Title (中): 堆叠互连散热器
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Application No.: US13921707Application Date: 2013-06-19
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Publication No.: US09054064B2Publication Date: 2015-06-09
- Inventor: Mark A Bachman , John W Osenbach , Sailesh M Merchant
- Applicant: LSI Corporation
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Suiter Swantz pc llo
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/34 ; H01L23/367 ; H01L25/065 ; H05K1/02 ; H01L23/31 ; H01L23/00
Abstract:
A heat spreader that is configured to be attached to an integrated circuit substrate. The heat spreader includes a thermally conductive core and a heat spreader via that passes through the thermally conductive core. A connection point of the thermally conductive core is configured to form a solder connection to an integrated circuit substrate plug.
Public/Granted literature
- US20130280864A1 STACKED INTERCONNECT HEAT SINK Public/Granted day:2013-10-24
Information query
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