Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14014157Application Date: 2013-08-29
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Publication No.: US09054066B2Publication Date: 2015-06-09
- Inventor: Tsuneo Ogura , Tomoko Matsudai , Yuuichi Oshino , Yoshiko Ikeda , Kazutoshi Nakamura , Ryohei Gejo
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick
- Priority: JP2012-190638 20120830; JP2013-110389 20130524
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L29/08 ; H01L29/40 ; H01L29/861 ; H01L29/872 ; H01L29/739 ; H01L29/78 ; H01L29/06

Abstract:
According one embodiment, a semiconductor device includes: a first electrode; a second electrode; a first semiconductor layer provided between the first electrode and the second electrode and being in contact with the first electrode; a second semiconductor layer including a first part and a second part, and the second part being contact with the first electrode, and the second semiconductor layer having an effective impurity concentration lower than an effective impurity concentration in the first semiconductor layer; a third semiconductor layer provided between the second semiconductor layer and the second electrode, and having an effective impurity concentration lower than an effective impurity concentration in the second semiconductor layer; and a fourth semiconductor layer provided between the third semiconductor layer and the second electrode, and being in contact with the second electrode.
Public/Granted literature
- US20140061875A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-03-06
Information query
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