Invention Grant
US09054086B2 Module having a stacked passive element and method of forming the same
有权
具有堆叠无源元件的模块及其形成方法
- Patent Title: Module having a stacked passive element and method of forming the same
- Patent Title (中): 具有堆叠无源元件的模块及其形成方法
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Application No.: US12244669Application Date: 2008-10-02
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Publication No.: US09054086B2Publication Date: 2015-06-09
- Inventor: Ashraf W. Lotfi , Douglas Dean Lopata , John David Weld , Mathew A. Wilkowski
- Applicant: Ashraf W. Lotfi , Douglas Dean Lopata , John David Weld , Mathew A. Wilkowski
- Applicant Address: US NJ Hampton
- Assignee: Enpirion, Inc.
- Current Assignee: Enpirion, Inc.
- Current Assignee Address: US NJ Hampton
- Agency: Boisbrun Hofman, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L51/52 ; H01F17/00 ; H01F27/22 ; H01L23/00
Abstract:
A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.
Public/Granted literature
- US20100084750A1 MODULE HAVING A STACKED PASSIVE ELEMENT AND METHOD OF FORMING THE SAME Public/Granted day:2010-04-08
Information query
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