Invention Grant
US09054092B2 Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes
有权
用于在集成电路引线表面上停止树脂渗出和模具闪光的方法和设备
- Patent Title: Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes
- Patent Title (中): 用于在集成电路引线表面上停止树脂渗出和模具闪光的方法和设备
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Application No.: US14064671Application Date: 2013-10-28
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Publication No.: US09054092B2Publication Date: 2015-06-09
- Inventor: Bernardo Gallegos , Yong Lin
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495
Abstract:
A method and apparatus of minimizing resin bleed and mold flash on integrated lead finishes by providing groves on the external leads that can control the length of resin bleed.
Public/Granted literature
- US20150115421A1 METHOD AN APPARATUS FOR STOPPING RESIN BLEED AND MOLD FLASH ON INTEGRATED CIRCIT LEAD FINISHES Public/Granted day:2015-04-30
Information query
IPC分类:
