Invention Grant
- Patent Title: Semiconductor device and a manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14329294Application Date: 2014-07-11
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Publication No.: US09054102B2Publication Date: 2015-06-09
- Inventor: Hiromasa Yoshimori , Hirofumi Shinohara , Toshiaki Iwamatsu
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2011-265852 20111205
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L27/088 ; H01L29/66 ; H01L21/8234 ; H01L21/8238

Abstract:
The performances of a semiconductor device are improved. The device includes a first MISFET in which hafnium is added to the gate electrode side of a first gate insulation film including silicon oxynitride, and a second MISFET in which hafnium is added to the gate electrode side of a second gate insulation film including silicon oxynitride. The hafnium concentration in the second gate insulation film of the second MISFET is set smaller than the hafnium concentration in the first gate insulation film of the first MISFET; and the nitrogen concentration in the second gate insulation film of the second MISFET is set smaller than the nitrogen concentration in the first gate insulation film of the first MISFET. As a result, the threshold voltage of the second MISFET is adjusted to be smaller than the threshold voltage of the first MISFET.
Public/Granted literature
- US20140319618A1 SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF Public/Granted day:2014-10-30
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