Invention Grant
- Patent Title: Semiconductor package and method for fabricating the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13934485Application Date: 2013-07-03
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Publication No.: US09054105B2Publication Date: 2015-06-09
- Inventor: Keun-Ho Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2012-0074540 20120709
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/522 ; H01L23/31 ; H01L23/498 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor package includes a mounting board including a bonding pad, first and second semiconductor chips sequentially stacked on the mounting board, a first wire connecting a first region of the bonding pad to a chip pad of the first semiconductor chip, and a second wire connecting the first region of the bonding pad to a chip pad of the second semiconductor chip, the second wire having a reverse loop configuration.
Public/Granted literature
- US20140008796A1 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-01-09
Information query
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