Invention Grant
- Patent Title: Substrate transfer apparatus
- Patent Title (中): 基板转印装置
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Application No.: US13604477Application Date: 2012-09-05
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Publication No.: US09054145B2Publication Date: 2015-06-09
- Inventor: Daisuke Uekawa , Kazuaki Yamada
- Applicant: Daisuke Uekawa , Kazuaki Yamada
- Applicant Address: JP Shizuoka-ken
- Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee: Yamaha Hatsudoki Kabushiki Kaisha
- Current Assignee Address: JP Shizuoka-ken
- Agency: Studebaker & Brackett PC
- Priority: JP2011-210245 20110927
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H01L21/677 ; H05K13/02 ; H05K13/00 ; H05K13/08

Abstract:
A substrate stopped at a first position is transferred toward a second position and is stopped at the second position in an accurate and stable manner. An intermediate position arrival time AT is measured while the substrate is being transferred from a substrate stop position toward a mounting work position, and a transfer status of the substrate (whether or not an unexpected factor has occurred) is assessed based on the intermediate position arrival time AT. Before the substrate reaches the second position, a deceleration pattern is controlled by altering a deceleration start timing T14 and the deceleration b in accordance with the intermediate position arrival time AT, thereby accurately stopping and positioning the substrate at the mounting work position. In this manner, under feed-forward control, the substrate can be stably transferred to the mounting work position.
Public/Granted literature
- US20130074326A1 SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND SURFACE MOUNTER Public/Granted day:2013-03-28
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