Invention Grant
US09054146B2 Substrate transfer equipment and high speed substrate processing system using the same 有权
基板转移设备和高速基板处理系统使用相同

  • Patent Title: Substrate transfer equipment and high speed substrate processing system using the same
  • Patent Title (中): 基板转移设备和高速基板处理系统使用相同
  • Application No.: US12298972
    Application Date: 2007-05-01
  • Publication No.: US09054146B2
    Publication Date: 2015-06-09
  • Inventor: Soon-Im Wi
  • Applicant: Soon-Im Wi
  • Applicant Address: KR Gyeonggi-do
  • Assignee: NEW POWER PLASMA CO., LTD.
  • Current Assignee: NEW POWER PLASMA CO., LTD.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: IP & T Group LLP
  • Priority: KR10-2006-0039744 20060503; KR10-2006-0090225 20060918; KR10-2006-0129476 20061218; KR10-2007-0007160 20070123
  • International Application: PCT/KR2007/002133 WO 20070501
  • International Announcement: WO2007/126289 WO 20071108
  • Main IPC: H01L21/677
  • IPC: H01L21/677 H01L21/687 H01L21/67
Substrate transfer equipment and high speed substrate processing system using the same
Abstract:
There are provided a substrate transferring apparatus for continuously loading/unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity and a substrate processing system using the same. The substrate transfer apparatus is installed in the transfer chamber and transfers substrates between first and second process chambers which is positioned lateral sides of the transfer chamber and a load rock chamber. The substrate transfer apparatus includes a driving unit to supply a rotational force, a spindle connected to the driving unit, first swivel plate arms to load/unload substrate to/from first process chamber, and second swivel plate arms to load/unload substrate to/from second process chamber. Since substrates before and after being processed are rapidly exchanged during the simultaneous or continuous process of plural substrates, processing rate increases and overall productivity can be increased.
Information query
Patent Agency Ranking
0/0