Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14194378Application Date: 2014-02-28
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Publication No.: US09054152B2Publication Date: 2015-06-09
- Inventor: Tsuneo Ogura , Kazutoshi Nakamura
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2013-149748 20130718
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739

Abstract:
A semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type on the first semiconductor region, a third semiconductor region of the first conductivity type on the second semiconductor region, a control electrode disposed within and insulated from the first, second, and third semiconductor regions, a first electrode electrically connected with the second and third semiconductor regions, a second electrode, and a fourth semiconductor region of the second conductivity type between the second electrode and the first semiconductor region. The fourth semiconductor region includes a first portion having a first dopant concentration and a second portion having a second dopant concentration higher than the first dopant concentration, and a contact area of the first portion with the second electrode is larger than a contact area of the second area with the second electrode.
Public/Granted literature
- US20150021655A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-01-22
Information query
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