Invention Grant
- Patent Title: Interconnect structure and method for fabricating on-chip interconnect structures by image reversal
- Patent Title (中): 通过图像反转制造片上互连结构的互连结构和方法
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Application No.: US13088054Application Date: 2011-04-15
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Publication No.: US09054160B2Publication Date: 2015-06-09
- Inventor: Robert L. Bruce , Qinghuang Lin , Alshakim Nelson , Satyanarayana V. Nitta , Dirk Pfeiffer , Jitendra S. Rathore
- Applicant: Robert L. Bruce , Qinghuang Lin , Alshakim Nelson , Satyanarayana V. Nitta , Dirk Pfeiffer , Jitendra S. Rathore
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Louis J. Percello
- Main IPC: H01L21/4763
- IPC: H01L21/4763 ; H01L21/768 ; H01L23/522 ; H01L23/532
Abstract:
An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region.
Public/Granted literature
- US20120261828A1 INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING ON-CHIP INTERCONNECT STRUCTURES BY IMAGE REVERSAL Public/Granted day:2012-10-18
Information query
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