Invention Grant
- Patent Title: Curved wafer processing on method and apparatus
- Patent Title (中): 方法和装置上的弯曲晶片加工
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Application No.: US13404819Application Date: 2012-02-24
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Publication No.: US09054188B2Publication Date: 2015-06-09
- Inventor: I-Ming Chang , Wen-Huei Guo , Chih-Hao Chang , Shou-Zen Chang , Clement Hsingjen Wann , Tung Ying Lee , Cheng-Long Chen , Jui-Chien Huang
- Applicant: I-Ming Chang , Wen-Huei Guo , Chih-Hao Chang , Shou-Zen Chang , Clement Hsingjen Wann , Tung Ying Lee , Cheng-Long Chen , Jui-Chien Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/3205
- IPC: H01L21/3205 ; H01L21/683 ; H01L21/687 ; H01L21/31 ; H01L29/78 ; H01L29/10 ; H01L29/66
Abstract:
An apparatus for and a method of forming a semiconductor structure is provided. The apparatus includes a substrate holder that maintains a substrate such that the processing surface is curved, such as a convex or a concave shape. The substrate is held in place using point contacts, a plurality of continuous contacts extending partially around the substrate, and/or a continuous ring extending completely around the substrate. The processing may include, for example, forming source/drain regions, channel regions, silicides, stress memorization layers, or the like.
Public/Granted literature
- US20130224952A1 Curved Wafer Processing on Method and Apparatus Public/Granted day:2013-08-29
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