Invention Grant
- Patent Title: Method for the wafer-level integration of shape memory alloy wires
- Patent Title (中): 形状记忆合金线晶圆级整合的方法
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Application No.: US13885257Application Date: 2011-11-22
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Publication No.: US09054224B2Publication Date: 2015-06-09
- Inventor: Stefan Braun , Frank Niklaus , Andreas Fischer , Henrik Gradin
- Applicant: Stefan Braun , Frank Niklaus , Andreas Fischer , Henrik Gradin
- Applicant Address: SE Delsbo
- Assignee: SENSEAIR AB
- Current Assignee: SENSEAIR AB
- Current Assignee Address: SE Delsbo
- Agency: Drinker Biddle & Reath LLP
- Priority: SE1001126 20101122
- International Application: PCT/SE2011/051404 WO 20111122
- International Announcement: WO2012/071003 WO 20120531
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/52 ; H01L23/00 ; B23K20/00
Abstract:
The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
Public/Granted literature
- US20130292856A1 METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES Public/Granted day:2013-11-07
Information query
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