Invention Grant
- Patent Title: Light emitting diode package and method of manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US12879999Application Date: 2010-09-10
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Publication No.: US09054283B2Publication Date: 2015-06-09
- Inventor: Bo Geun Park
- Applicant: Bo Geun Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2005-0101772 20051027
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/54 ; B29C39/02 ; B29C39/10 ; B29L11/00

Abstract:
According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate, wherein the at least two distinct electrodes are spaced from each other; a light emitting device on one of the at least two distinct electrodes; lenses including a first lens and a second lens on the substrate, wherein the second lens is disposed on the first lens, wherein an outermost portion of the second lens is spaced from the substrate; and a supporting unit configured to directly contact the second lens, wherein the supporting unit is formed of a non-conductivity material.
Public/Granted literature
- US20100327308A1 LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-12-30
Information query
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