Invention Grant
- Patent Title: Electronic devices with yielding substrates
- Patent Title (中): 具有屈服底物的电子设备
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Application No.: US14456573Application Date: 2014-08-11
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Publication No.: US09054290B2Publication Date: 2015-06-09
- Inventor: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant Address: CA Richmond
- Assignee: Cooledge Lighting Inc.
- Current Assignee: Cooledge Lighting Inc.
- Current Assignee Address: CA Richmond
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00 ; H01L33/62 ; H05K3/32 ; H01L33/60 ; H01L33/08 ; H01L33/32 ; H01L33/50 ; H01L33/58 ; H01L27/15 ; H01L23/367 ; H01L23/498 ; H01L23/00 ; H01L33/48 ; H05K1/18 ; G02F1/1335
Abstract:
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Public/Granted literature
- US20150001465A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES Public/Granted day:2015-01-01
Information query
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