Invention Grant
- Patent Title: Press bond terminal
- Patent Title (中): 按债券终端
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Application No.: US13504292Application Date: 2010-10-25
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Publication No.: US09054431B2Publication Date: 2015-06-09
- Inventor: Tatsuya Endo
- Applicant: Tatsuya Endo
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-247863 20091028
- International Application: PCT/JP2010/068881 WO 20101025
- International Announcement: WO2011/052548 WO 20110505
- Main IPC: H01R4/10
- IPC: H01R4/10 ; H01R4/18 ; H01R4/20 ; H01R43/16 ; H01R13/11

Abstract:
A press bond terminal in which the terminal is provided with an electrical connection part on which is provided a conductor press bond part connected by being pressed and bonded to a conductor of an electric wire through a first joining part and the conductor press bond part is further provided with a coating crimp part through a second joining part and the conductor press bond part is formed in substantially a U-shaped cross section by a base plate and a pair of conductor crimp pieces and both joining parts are formed in substantially U-shaped cross sections by base plates and a pair of low side plates, with projections provided on any inner surfaces of the conductor crimp pieces or inner surfaces of the side plates of the joining parts.
Public/Granted literature
- US20120214361A1 PRESS BOND TERMINAL Public/Granted day:2012-08-23
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