Invention Grant
- Patent Title: Structures for seamless coupling of device members
- Patent Title (中): 用于设备构件无缝耦合的结构
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Application No.: US13768613Application Date: 2013-02-15
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Publication No.: US09054439B1Publication Date: 2015-06-09
- Inventor: Marc Rene Walliser
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Sutherland Asbill & Brennan LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R13/502 ; H01R43/20 ; H01R13/74

Abstract:
Devices having embedded structural features that permit assembly of such devices in a manner that design efficiencies and packaging efficiencies can be accomplished satisfactorily and substantially without mutual exclusivity. In one aspect, structure(s) associated with a functionality of user equipment can be leveraged in order to couple a front housing of the user equipment with a rear housing thereof. In another aspect, leveraging such structure can permit assembly of the user equipment in a manner that provides a seamless appearance of the user equipment and mechanical reliability and/or versatility.
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