Invention Grant
- Patent Title: Integrated circuit assembly for high-frequency on-board printed circuit board testing,validation, and verification
- Patent Title (中): 用于高频板载印刷电路板测试，验证和验证的集成电路组件
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Application No.: US13586981Application Date: 2012-08-16
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Publication No.: US09054466B2Publication Date: 2015-06-09
- Inventor: David S. Lin
- Applicant: David S. Lin
- Applicant Address: TW Taipei
- Assignee: UNIGEN TAIWAN CORPORATION
- Current Assignee: UNIGEN TAIWAN CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Ladas & Parry LLP
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01R12/71 ; H01R12/73 ; H05K1/14 ; H05K3/32 ; H05K3/34
Abstract:
An integrated circuit assembly includes a main board unit mounted fixedly on and connected electrically to an external circuit board, a daughter board unit disposed on and connected detachably to the main board unit, and an integrated circuit device mounted fixedly on and connected electrically to the daughter board unit. When the daughter board unit is connected to the main board unit, the integrated circuit device is connected electrically to the external circuit board via the main board unit and the daughter board unit.
Public/Granted literature
- US20140049896A1 INTEGRATED CIRCUIT ASSEMBLY Public/Granted day:2014-02-20
Information query
