Invention Grant
- Patent Title: Processor loading system
- Patent Title (中): 处理器加载系统
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Application No.: US13623303Application Date: 2012-09-20
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Publication No.: US09054473B2Publication Date: 2015-06-09
- Inventor: Lawrence Alan Kyle
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: H01R12/50
- IPC: H01R12/50 ; H05K7/10 ; G06F1/18 ; H01L23/40
Abstract:
A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.
Public/Granted literature
- US20130017704A1 PROCESSOR LOADING SYSTEM Public/Granted day:2013-01-17
Information query
