Invention Grant
- Patent Title: Cooling device and semiconductor laser device
- Patent Title (中): 冷却装置和半导体激光装置
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Application No.: US14133886Application Date: 2013-12-19
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Publication No.: US09054481B2Publication Date: 2015-06-09
- Inventor: Yoshiro Asano
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2012-282090 20121226
- Main IPC: H01S3/04
- IPC: H01S3/04 ; H01S5/022 ; H01S5/024 ; H01S5/06 ; H01S5/40

Abstract:
There is provided a semiconductor laser device including a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated, a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed, and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.
Public/Granted literature
- US20140177662A1 COOLING DEVICE AND SEMICONDUCTOR LASER DEVICE Public/Granted day:2014-06-26
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