Disclosed is a haptic module using a piezoelectric element. The haptic module comprises a base, a vibration member which is mounted on the upper portion of the base so as to be vertically movable, a piezoelectric element which couples to the vibration member, a power portion for applying power to the piezoelectric element, and a panel member which is mounted to the upper portion of the vibration member. According to the present invention, vertical movement of the vibration member effectively sends force to the panel member by means of the piezoelectric element to facilitate the vertical movement and enhance driving force, and thereby enhances the feeling of vibration or clicking of the panel member.