Invention Grant
- Patent Title: Acoustic wave filter, communication module, and method for manufacturing the filter
- Patent Title (中): 声波滤波器，通讯模块及滤波器制造方法
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Application No.: US13425001Application Date: 2012-03-20
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Publication No.: US09054674B2Publication Date: 2015-06-09
- Inventor: Kazunori Inoue , Jun Tsutsumi , Kazuhiro Matsumoto , Takashi Matsuda
- Applicant: Kazunori Inoue , Jun Tsutsumi , Kazuhiro Matsumoto , Takashi Matsuda
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2009-222661 20090928
- Main IPC: H03H9/70
- IPC: H03H9/70 ; H03H9/72 ; H03H9/02 ; H03H3/02 ; H03H3/08 ; H03H9/56 ; H03H9/64
Abstract:
An acoustic wave filter includes: a substrate; resonators that are arranged on the substrate and excite acoustic waves; a ground terminal on the substrate; interconnection lines interconnecting the resonators and connecting predetermined ones of the resonators to the ground terminal; and a shield electrode disposed so as to be close to and face the interconnection lines.
Public/Granted literature
- US20120176206A1 ACOUSTIC WAVE FILTER, COMMUNICATION MODULE, AND METHOD FOR MANUFACTURING THE FILTER Public/Granted day:2012-07-12
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