Invention Grant
- Patent Title: Camera module
- Patent Title (中): 相机模块
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Application No.: US13801221Application Date: 2013-03-13
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Publication No.: US09055208B2Publication Date: 2015-06-09
- Inventor: Hack Ho Kim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch LLP
- Priority: KR10-2012-0028565 20120321
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/232

Abstract:
A camera module according to an exemplary embodiment of the present disclosure includes a housing forming an exterior appearance of the camera module, a PCB (Printed Circuit Board) mounted with an image sensor where one end of which is fixed to the housing and the other end is exposed to an outside to be connected to other parts, a lens holder including at least one or more pieces of lenses and so arranged as to be spaced apart from the image sensor at a predetermined distance, and at least two actuators mounted at areas other than an image sensor-mounted area of the PCB, wherein a position of the image sensor is controlled in response to strains of the actuators.
Public/Granted literature
- US20130250169A1 CAMERA MODULE Public/Granted day:2013-09-26
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