Invention Grant
- Patent Title: Deposition apparatus and deposition method
- Patent Title (中): 沉积设备和沉积方法
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Application No.: US13637627Application Date: 2011-02-10
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Publication No.: US09055653B2Publication Date: 2015-06-09
- Inventor: Tohru Sonoda , Nobuhiro Hayashi , Shinichi Kawato , Satoshi Inoue
- Applicant: Tohru Sonoda , Nobuhiro Hayashi , Shinichi Kawato , Satoshi Inoue
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Morrison & Foerster LLP
- Priority: JP2010-091481 20100412
- International Application: PCT/JP2011/000764 WO 20110210
- International Announcement: WO2011/129043 WO 20111020
- Main IPC: C23C14/24
- IPC: C23C14/24 ; C23C14/04 ; H05B33/10 ; C23C14/12 ; C23C14/22 ; H01L27/32 ; H01L51/56 ; H01L51/00

Abstract:
A deposition apparatus 50 forms a thin film 3 in a predetermined pattern on a substrate 10 for an organic EL display. A first correction plate 81 and a second correction plate 82 are placed between a shadow mask 60 and a deposition source 53 that emits deposition particles. Each of the correction plates 81, 82 has a plurality of blade plates 83 and a frame 84 that supports the plurality of blade plates 83. The blade plates 83 are placed so as to be tilted with respect to the shadow mask 60, and to extend parallel to each other with an opening 86 between adjoining ones of the blade plates 83 as viewed in a direction perpendicular the deposition mask 60.
Public/Granted literature
- US20130017320A1 DEPOSITION APPARATUS AND DEPOSITION METHOD Public/Granted day:2013-01-17
Information query
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