Invention Grant
- Patent Title: Method for manufacturing outer conductor
- Patent Title (中): 外导体制造方法
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Application No.: US13635763Application Date: 2011-03-24
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Publication No.: US09055659B2Publication Date: 2015-06-09
- Inventor: Haruki Hitomi , Katsuya Sennyu , Hiroshi Hara
- Applicant: Haruki Hitomi , Katsuya Sennyu , Hiroshi Hara
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2010-090321 20100409
- International Application: PCT/JP2011/057124 WO 20110324
- International Announcement: WO2011/125511 WO 20111013
- Main IPC: H01L39/24
- IPC: H01L39/24 ; H05H7/02 ; B21D51/16 ; H05H7/22 ; H05H7/20 ; B21D22/20

Abstract:
A method for manufacturing an outer conductor of a higher-order-mode coupler for a superconducting acceleration cavity. The outer conductor includes a cylindrical main body that is open at one end surface thereof, a port formed in a side of the main body so as to penetrate therethrough, and a protruding part formed outside another end surface of the main body. The method includes a deep drawing step of deep-drawing a metal plate to form the main body, a port-forming step of flanging the thus-formed main body to form the port, and a first machining step of machining the main body to adjust an outer shape thereof.
Public/Granted literature
- US20130008021A1 METHOD FOR MANUFACTURING OUTER CONDUCTOR Public/Granted day:2013-01-10
Information query
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