Invention Grant
- Patent Title: Method for attaching a flexible structure to a device and a device having a flexible structure
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Application No.: US13549489Application Date: 2012-07-15
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Publication No.: US09055681B2Publication Date: 2015-06-09
- Inventor: Roger Dangel , Laurent Dellmann , Michel Despont , Bert Jan Offrein , Stefano Sergio Oggioni
- Applicant: Roger Dangel , Laurent Dellmann , Michel Despont , Bert Jan Offrein , Stefano Sergio Oggioni
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Ido Tuchman; William J. Stock
- Priority: EP05405501 20050831
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B81C3/00 ; H05K3/46 ; G02B6/43 ; H01L27/146 ; H05K1/18
Abstract:
Techniques for producing a flexible structure attached to a device. One embodiment includes the steps of providing a first substrate, providing a second substrate with a releasably attached flexible structure, providing a bonding layer on at least one of the first substrate and the flexible structure, adjoining the first and second substrate such that the flexible structure is attached at the first substrate by means of the bonding layer, and detaching the second substrate in such a way that the flexible structure remains on the first substrate.
Public/Granted literature
- US20120279763A1 METHOD FOR ATTACHING A FLEXIBLE STRUCTURE TO A DEVICE AND A DEVICE HAVING A FLEXIBLE STRUCTURE Public/Granted day:2012-11-08
Information query
