Invention Grant
- Patent Title: Explosion-proof electronic device and manufacturing method thereof
- Patent Title (中): 防爆电子装置及其制造方法
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Application No.: US13908464Application Date: 2013-06-03
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Publication No.: US09055686B2Publication Date: 2015-06-09
- Inventor: Takuya Tanaka
- Applicant: JVC KENWOOD CORPORATION
- Applicant Address: JP Yokohama-Shi, Kanagawa
- Assignee: JVC KENWOOD CORPORATION
- Current Assignee: JVC KENWOOD CORPORATION
- Current Assignee Address: JP Yokohama-Shi, Kanagawa
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tiffany A. Johnson
- Priority: JP2012-128448 20120605
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K3/36 ; H05K5/06 ; H01R12/52 ; H01R13/533

Abstract:
An explosion-proof electronic device includes: a first circuit board provided with a first connector on one surface thereof; and a second circuit board provided with a second connector on a surface facing the one surface of the first circuit board, the second connector being fit to the first connector. A packing is attached to a position on the second connector which is away from the surface of the second circuit board, surrounds the outer circumference of the second connector, and extends toward the first circuit board to form a closed space including an interface between the first and second connectors. The space between the first and second circuit boards is filled with a filler with the first and second connectors fit to each other.
Public/Granted literature
- US20130322043A1 EXPLOSION-PROOF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-12-05
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