Invention Grant
US09055702B2 Method for forming a circuit board via structure for high speed signaling
有权
用于形成用于高速信号的电路板通孔结构的方法
- Patent Title: Method for forming a circuit board via structure for high speed signaling
- Patent Title (中): 用于形成用于高速信号的电路板通孔结构的方法
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Application No.: US14010051Application Date: 2013-08-26
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Publication No.: US09055702B2Publication Date: 2015-06-09
- Inventor: Shiyou Zhao , Houfei Chen , Hao Wang
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K3/42 ; H05K1/02 ; H05K1/16 ; H05K1/11
Abstract:
One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.
Public/Granted literature
- US20130340250A1 Method for Forming a Circuit Board Via Structure for High Speed Signaling Public/Granted day:2013-12-26
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