Invention Grant
- Patent Title: Hot press device and multi-layered printed board press method
- Patent Title (中): 热压装置和多层印刷板印刷方法
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Application No.: US13329589Application Date: 2011-12-19
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Publication No.: US09055704B2Publication Date: 2015-06-09
- Inventor: Kouji Kose , Kouta Togawa , Katsuro Kawazoe , Takayoshi Kojima
- Applicant: Kouji Kose , Kouta Togawa , Katsuro Kawazoe , Takayoshi Kojima
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2010-282698 20101220
- Main IPC: B30B7/02
- IPC: B30B7/02 ; H05K3/46

Abstract:
A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.
Public/Granted literature
- US20120152457A1 HOT PRESS DEVICE AND MULTI-LAYERED PRINTED BOARD PRESS METHOD Public/Granted day:2012-06-21
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