Invention Grant
- Patent Title: Method for integrating an electronic component into a printed circuit board
- Patent Title (中): 将电子元件集成到印刷电路板中的方法
-
Application No.: US13635364Application Date: 2011-04-11
-
Publication No.: US09055706B2Publication Date: 2015-06-09
- Inventor: Johannes Stahr , Markus Leitgeb
- Applicant: Johannes Stahr , Markus Leitgeb
- Applicant Address: AT Leoben-Hinterberg
- Assignee: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Current Assignee: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Current Assignee Address: AT Leoben-Hinterberg
- Agency: Jacobson Holman, PLLC.
- Priority: ATGM236/2010 20100413
- International Application: PCT/AT2011/000172 WO 20110411
- International Announcement: WO2011/127503 WO 20111020
- Main IPC: H05K3/20
- IPC: H05K3/20 ; H05K3/46 ; H05K1/18
Abstract:
A method for integrating a component into a printed circuit board includes the following steps: providing two completed printed circuit board elements, which more particularly consist of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression, arranging the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component integrated therein is provided.
Public/Granted literature
Information query
