Invention Grant
- Patent Title: Die bond system
- Patent Title (中): 死亡债券制度
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Application No.: US13719240Application Date: 2012-12-19
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Publication No.: US09055707B2Publication Date: 2015-06-09
- Inventor: Chih-Chen Lai
- Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H01L21/67 ; H01L21/683

Abstract:
A die bonding system for bonding a die on a substrate is provided. The die bonding system includes a supporting base for the substrate, a die pickup device for picking up the die, and an alerting device. The supporting base includes a number of conductive and height-adjustable upper portions. The upper portions are spaced from each other. The alerting device includes a power source and an alerting element electrically connected to the power source. Two electrodes of the power source are electrically connected to the die pickup device and the upper portions, and the alerting element generates different alerts according to different contacting status of the upper portions and the die pickup device.
Public/Granted literature
- US20130232775A1 DIE BOND SYSTEM Public/Granted day:2013-09-12
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