Invention Grant
- Patent Title: Substrate-related-operation performing apparatus and substrate-related-operation performing system
- Patent Title (中): 基板相关操作执行装置和基板相关操作执行系统
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Application No.: US14043088Application Date: 2013-10-01
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Publication No.: US09055708B2Publication Date: 2015-06-09
- Inventor: Seigo Kodama , Shinsuke Suhara
- Applicant: FUJI MACHINE MFG. CO., LTD.
- Applicant Address: JP Chiryu
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu
- Agency: Oliff PLC
- Priority: JP2002-337739 20021121; JP2003-128348 20030506
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04

Abstract:
A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.
Public/Granted literature
- US20140026410A1 SUBSTRATE-RELATED-OPERATION PERFORMING APPARATUS AND SUBSTRATE-RELATED-OPERATION PERFORMING SYSTEM Public/Granted day:2014-01-30
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