Invention Grant
- Patent Title: Electronic component feeder
- Patent Title (中): 电子元件馈线
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Application No.: US12689391Application Date: 2010-01-19
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Publication No.: US09055709B2Publication Date: 2015-06-09
- Inventor: Jhin-Woo Shin , Tae-Sung Jang , Jong-Eok Ban
- Applicant: Jhin-Woo Shin , Tae-Sung Jang , Jong-Eok Ban
- Applicant Address: KR Changwon-Si
- Assignee: SAMSUNG TECHWIN CO., LTD.
- Current Assignee: SAMSUNG TECHWIN CO., LTD.
- Current Assignee Address: KR Changwon-Si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2009-0004056 20090119
- Main IPC: H05K13/04
- IPC: H05K13/04 ; B65H37/00

Abstract:
An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.
Public/Granted literature
- US20100180435A1 ELECTRONIC COMPONENT FEEDER AND CHIP MOUNTER HAVING THE SAME Public/Granted day:2010-07-22
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