Invention Grant
- Patent Title: Use of a composition for contact with supercritical media
- Patent Title (中): 使用组合物与超临界介质接触
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Application No.: US13128297Application Date: 2009-10-07
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Publication No.: US09057466B2Publication Date: 2015-06-16
- Inventor: Andreas Dowe , Reinhard Beuth , Franz-Erich Baumann
- Applicant: Andreas Dowe , Reinhard Beuth , Franz-Erich Baumann
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102008044224 20081201
- International Application: PCT/EP2009/063025 WO 20091007
- International Announcement: WO2010/063506 WO 20100610
- Main IPC: B29C47/88
- IPC: B29C47/88 ; F16L11/08 ; C08L77/00 ; C08L77/06 ; C08L77/12 ; F16L9/147 ; F16L11/06

Abstract:
A molding composition which comprises at least 50% by weight of the following constituents: a) from 0 to 99 parts by weight of polyamide, and b) from 1 to 100 parts by weight of polyamide elastomer, selected from the group of polyetheresteramide and polyetheramide, where the total of the parts by weight is 100 and where the molding composition comprises from 0 to 9% by weight of plasticizer, is used for the production of a molding for contact with a supercritical medium, and preferably for the production of an inner thermoplastics layer in a flexible pipe or rigid pipe, in which a supercritical medium is conveyed. Low or zero plasticizer content eliminates any significant occurrence of problems such as increased stiffness and longitudinal shrinkage.
Public/Granted literature
- US20110209768A1 USE OF A COMPOSITION FOR CONTACT WITH SUPERCRITICAL MEDIA Public/Granted day:2011-09-01
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