Invention Grant
US09059317B2 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
有权
制造具有叠层在互连层堆叠上的液晶聚合物焊料掩模的电子器件及其相关器件的方法
- Patent Title: Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
- Patent Title (中): 制造具有叠层在互连层堆叠上的液晶聚合物焊料掩模的电子器件及其相关器件的方法
-
Application No.: US14162959Application Date: 2014-01-24
-
Publication No.: US09059317B2Publication Date: 2015-06-16
- Inventor: Louis Joseph Rendek, Jr. , Michael Raymond Weatherspoon , Casey Philip Rodriguez , David Nicol
- Applicant: HARRIS CORPORATION
- Applicant Address: US FL Melbourne
- Assignee: HARRIS CORPORATION
- Current Assignee: HARRIS CORPORATION
- Current Assignee Address: US FL Melbourne
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L25/065 ; H05K1/03 ; H05K3/28 ; H05K3/34
Abstract:
A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.
Public/Granted literature
Information query
IPC分类:
