Invention Grant
US09062172B2 Resin composition adhesive film and prepreg containing the same, multilayered printed wiring board containing an insulating layer formed by curing such a resin composition, semiconductor device containing such a multilayered printed wiring board, and method of producing such a resin composition
有权
树脂组合物粘合剂膜和含有该树脂组合物的预浸料，含有通过固化这种树脂组合物形成的绝缘层的多层印刷布线板，含有这种多层印刷线路板的半导体器件，以及这种树脂组合物的制造方法
- Patent Title: Resin composition adhesive film and prepreg containing the same, multilayered printed wiring board containing an insulating layer formed by curing such a resin composition, semiconductor device containing such a multilayered printed wiring board, and method of producing such a resin composition
- Patent Title (中): 树脂组合物粘合剂膜和含有该树脂组合物的预浸料，含有通过固化这种树脂组合物形成的绝缘层的多层印刷布线板，含有这种多层印刷线路板的半导体器件，以及这种树脂组合物的制造方法
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Application No.: US12967344Application Date: 2010-12-14
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Publication No.: US09062172B2Publication Date: 2015-06-23
- Inventor: Shigeo Nakamura
- Applicant: Shigeo Nakamura
- Applicant Address: JP Tokyo
- Assignee: AJINOMOTO CO., INC.
- Current Assignee: AJINOMOTO CO., INC.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-282688 20091214
- Main IPC: H05K1/03
- IPC: H05K1/03 ; C08J5/24 ; B32B7/12 ; C08G59/24 ; C08L63/00 ; H05K3/46
Abstract:
A resin composition which is low in a roughness of an insulating layer surface and capable of forming thereon a plated conductor layer having a sufficient peel strength in a wet roughing step and which is excellent in dielectric characteristics and a coefficient of thermal expansion, is disclosed. The resin composition contains a cyanate ester resin and a specified epoxy resin.
Public/Granted literature
- US20110139496A1 RESIN COMPOSITION Public/Granted day:2011-06-16
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