Invention Grant
- Patent Title: Wafer edge inspection illumination system
- Patent Title (中): 晶圆边缘检查照明系统
-
Application No.: US13868710Application Date: 2013-04-23
-
Publication No.: US09062859B2Publication Date: 2015-06-23
- Inventor: Christopher Voges , Ajay Pai , Antony Ravi Philip , Tuan D. Le
- Applicant: Rudolph Technologies, Inc.
- Applicant Address: US NJ Flanders
- Assignee: Rudolph Technologies, Inc.
- Current Assignee: Rudolph Technologies, Inc.
- Current Assignee Address: US NJ Flanders
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: F21V13/02
- IPC: F21V13/02 ; G01N21/95
Abstract:
Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.
Public/Granted literature
- US20140063799A1 WAFER EDGE INSPECTION Public/Granted day:2014-03-06
Information query
