Invention Grant
- Patent Title: Radiation curable resin composition, and fingerprint-resistant resin composition containing same
- Patent Title (中): 辐射固化型树脂组合物和含有它的耐指纹树脂组合物
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Application No.: US13502230Application Date: 2009-10-16
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Publication No.: US09068085B2Publication Date: 2015-06-30
- Inventor: Jin Tae Kim , Moon Jae Kwon , Jae Ryung Lee , Han Seob Song , Young Woo Lee , Chang Se Byun , Jung Su Kim
- Applicant: Jin Tae Kim , Moon Jae Kwon , Jae Ryung Lee , Han Seob Song , Young Woo Lee , Chang Se Byun , Jung Su Kim
- Applicant Address: KR Pohang-si KR Ansan-si
- Assignee: POSCO,Samhwa Paints Industries Co., LTD.
- Current Assignee: POSCO,Samhwa Paints Industries Co., LTD.
- Current Assignee Address: KR Pohang-si KR Ansan-si
- Agency: The Webb Law Firm
- International Application: PCT/KR2009/005994 WO 20091016
- International Announcement: WO2011/046243 WO 20110421
- Main IPC: B32B15/08
- IPC: B32B15/08 ; C08L33/14 ; C08K7/00 ; C08K3/26 ; C08K3/34 ; C08K3/36 ; C08K3/22 ; C08F2/50 ; C09D4/00 ; C09D175/16 ; C08F220/18
Abstract:
A radiation-curable base resin composition and a fingerprint-resistant resin composition including the same are provided. The radiation-curable base resin composition includes a multifunctional urethane(meth)acrylate having three or more functional groups at 3 to 35 parts by weight, a bifunctional urethane(meth)acrylate at 3 to 35 parts by weight, at least one (meth)acrylic acid ester monomer selected from a monofunctional (meth)acrylic acid ester monomer and a multifunctional (meth)acrylic acid ester monomer at 20 to 60 parts by weight and a radiation polymerization initiator at 0.1 to 15 parts by weight.
Public/Granted literature
- US20120258324A1 Radiation Curable Resin Composition, and Fingerprint-Resistant Resin Composition Containing Same Public/Granted day:2012-10-11
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