Invention Grant
US09069246B2 Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method and resist film using the composition, and electronic device manufacturing method and electronic device using these
有权
使用该组合物的光化射线敏感性或辐射敏感性树脂组合物，图案形成方法和抗蚀剂膜以及使用这些的电子器件制造方法和电子器件
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method and resist film using the composition, and electronic device manufacturing method and electronic device using these
- Patent Title (中): 使用该组合物的光化射线敏感性或辐射敏感性树脂组合物，图案形成方法和抗蚀剂膜以及使用这些的电子器件制造方法和电子器件
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Application No.: US14458660Application Date: 2014-08-13
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Publication No.: US09069246B2Publication Date: 2015-06-30
- Inventor: Hiroo Takizawa , Tomotaka Tsuchimura
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-032099 20120216
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/027 ; G03F7/038 ; G03F7/039
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition containing a compound capable of generating an acid upon irradiation with an actinic ray or radiation, represented by the formula (Z1), and the formula (Z1) is defined as herein, and a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method comprising a step of forming a film by using the actinic ray-sensitive or radiation-sensitive resin composition, a step of exposing the film, and a step of developing the exposed film, a method for manufacturing an electronic device, comprising the pattern forming method, and an electronic device manufactured by the method for manufacturing an electronic device.
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