Invention Grant
- Patent Title: Composite substrate and method for manufacturing composite substrate
- Patent Title (中): 复合基板及复合基板的制造方法
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Application No.: US13295542Application Date: 2011-11-14
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Publication No.: US09070547B2Publication Date: 2015-06-30
- Inventor: Tomoyoshi Tai , Yuji Hori
- Applicant: Tomoyoshi Tai , Yuji Hori
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2010-254431 20101115
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46 ; H01L21/02 ; H01L21/265 ; H01L21/762 ; H01L33/00 ; H01S5/02 ; H01S5/323
Abstract:
A metal film is formed on at least a surface of a second substrate composed of ceramic (step c), and a first substrate composed of a group nitride is bonded to the second substrate through the metal film (step d). Since the metal film generally has higher thermal conductivity than oxide films, a composite substrate having high heat dissipation can be produced as compared with a case where the first substrate is bonded to the second substrate through an oxide film. In addition, a step of out diffusion is not required because of nonuse of an oxide film, thereby simplifying the process.
Public/Granted literature
- US20120119224A1 COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE Public/Granted day:2012-05-17
Information query
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