Invention Grant
US09070653B2 Microelectronic assembly having a heat spreader for a plurality of die
有权
具有用于多个管芯的散热器的微电子组件
- Patent Title: Microelectronic assembly having a heat spreader for a plurality of die
- Patent Title (中): 具有用于多个管芯的散热器的微电子组件
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Application No.: US13741743Application Date: 2013-01-15
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Publication No.: US09070653B2Publication Date: 2015-06-30
- Inventor: Tab A. Stephens , Michael B. McShane , Perry H. Pelley
- Applicant: Freescale Semiconductor, Inc.
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L25/04 ; H01L23/48 ; H01L25/00 ; H01L23/00 ; H01L25/065 ; H01L23/367
Abstract:
A microelectronic assembly (100) and a microelectronic device (4100) include a stacked structure (101). The stacked structure includes a heat spreader (104), at least one die (106) thermally coupled to at least a portion of one side of the heat spreader, at least one other die (108) thermal coupled to at least a portion of an opposite side of the heat spreader, at least one opening (401) in the heat spreader located in a region of between the two die, an insulator (603) disposed in the at least one opening, and electrically conductive material (1308, 1406) in an insulated hole (705) in the insulator. The heat spreader allows electrical communication between the two die through the opening while the insulator isolates the electrically conductive material and the heat spreader from each other.
Public/Granted literature
- US20140197541A1 MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE Public/Granted day:2014-07-17
Information query
IPC分类:
