Invention Grant
US09070788B2 Integrated circuit with a thin body field effect transistor and capacitor
有权
具有薄体场效应晶体管和电容器的集成电路
- Patent Title: Integrated circuit with a thin body field effect transistor and capacitor
- Patent Title (中): 具有薄体场效应晶体管和电容器的集成电路
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Application No.: US14168208Application Date: 2014-01-30
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Publication No.: US09070788B2Publication Date: 2015-06-30
- Inventor: Kangguo Cheng , Bruce Doris , Ali Khakifirooz , Ghavam G. Shahidi
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Thomas Grzesik
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L21/84 ; H01L27/12

Abstract:
An circuit supporting substrate includes a transistor and a capacitor. The transistor includes a first semiconductor layer and a gate stack located on the first semiconductor layer. The gate stack includes a metal layer and a first high-k dielectric layer. A gate spacer is located on sidewalls of the gate stack. The first high-k dielectric layer is located between the first semiconductor layer and the metal layer and between the gate spacer and sidewalls of the metal layer. A first silicide region is located on a first source/drain region. A second silicide region is located on a second source/drain region. The capacitor includes a first terminal that comprises a third silicide region located on a portion of the second semiconductor. A second high-k dielectric layer is located on the silicide region. A second terminal comprises a metal layer that is located on the second high-k dielectric layer.
Public/Granted literature
- US20140145254A1 INTEGRATED CIRCUIT WITH A THIN BODY FIELD EFFECT TRANSISTOR AND CAPACITOR Public/Granted day:2014-05-29
Information query
IPC分类: