A socket for electronic components includes a shield plate assembly that is formed by combining first shield plates with second shield plates in the form of a lattice and has conductivity, and contact units electrically connected to electrode terminals of electronic components are disposed in openings of the lattice of the shield plate assembly so that the electrode terminals are electrically connected to the wiring of a wiring board. The shield plate assembly is formed in a shape where lines where openings of the lattice are lined up in a first direction are arranged side by side in a second direction orthogonal to the first direction, and the openings of the adjacent lines are formed so as to be shifted relative to the openings of the next lines in the first direction by a half of the length of the side of the opening that extends in the first direction.