Invention Grant
- Patent Title: Sub-mount having photodiode and light-emitting element module
- Patent Title (中): 具有光电二极管和发光元件模块的子座
-
Application No.: US13615404Application Date: 2012-09-13
-
Publication No.: US09071032B2Publication Date: 2015-06-30
- Inventor: Yoshiteru Nagai
- Applicant: Yoshiteru Nagai
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-201586 20110915
- Main IPC: H01S5/0683
- IPC: H01S5/0683 ; H01L25/16 ; H01S5/022 ; H01S5/068

Abstract:
A sub-mount having a photodiode region, includes a photodiode which has a first conductivity-type layer arranged in a surface portion of the sub-mount of the photodiode region to form a light-receiving surface and a second conductivity-type region arranged below the first conductivity-type layer and is configured to receive at the light-receiving surface a light emitted from a light-emitting element and convert the light into a photocurrent. A peak light-receiving wavelength at which the photocurrent of the photodiode becomes its maximum value is more than or equal to a minimum emission wavelength of the light-emitting element and less than or equal to a maximum emission wavelength of the light-emitting element.
Public/Granted literature
- US20130068936A1 SUB-MOUNT AND LIGHT-EMITTING ELEMENT MODULE Public/Granted day:2013-03-21
Information query